Apparatus for treating substrate and method for treating a substrate
AssigneeSemes Co., Ltd.
InventorsMin Jung PARK, Soo Bin YONG, Jae Hoon PARK
Life of this patent
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Abstract
The inventive concept provides a substrate treating method. The substrate treating apparatus includes first treating including supplying a first liquid to a rotating substrate; and second treating including supplying a second liquid to the rotating substrate after the supplying of the first liquid, and wherein a rotation speed of a substrate is changed during the supplying of the first liquid to the rotating substrate.
Claims17
A substrate treating method comprising:
- first treating including supplying a first liquid to a rotating substrate;
- and
- second treating including supplying a second liquid to the rotating substrate after the supplying of the first liquid, and
- wherein a rotation speed of the substrate is changed during the supplying of the first liquid to the rotating substrate.
A substrate treating method for treating a substrate having patterns formed on a top surface thereof, the substrate treating method comprising:
- firstly supplying a liquid to a rotating substrate to permeate the liquid to a space between patterns;
- secondly supplying the liquid to the rotating substrate to diffuse the liquid toward an edge region of the substrate;
- and
- supplementary diffusing including supplying the liquid to the rotating substrate to secondly permeate the first liquid to the space between patterns, and
- wherein an average rotation speed of the substrate at the firstly supplying of the liquid, an average rotation speed of the substrate at the secondly supplying of the liquid, and an average rotation speed of the substrate at the supplementary diffusing are different from one another.
-20. (canceled)
Dependencies are inferred from the claim text.