Array substrate, liquid crystal display panel and liquid crystal display apparatus

An LCD panel, comprising:

• an opposite substrate and an array substrate, and an LC layer disposed between the opposite substrate and the array substrate;
• wherein the array substrate comprises:
• a base substrate, a first metal pattern layer and a protection layer arranged as stacked in sequence;
• wherein the array substrate further comprises:
• a display area and a peripheral area surrounding the display area, the peripheral area comprises a bonding area and a non-bonding area, and the bonding area is disposed on at least one side outside the display area;
• the first metal pattern layer comprises a plurality of conductive contacts disposed in the bonding area and arranged at intervals along a first direction and a plurality of signal leads disposed in the non-bonding area and having a bent shape, one terminal of each of the conductive contacts approaching the display area is connected with corresponding one of the signal leads, the conductive contacts extend along a second direction and are configured to bond with gold fingers on a circuit board to be bonded, the first direction is parallel to an edge of the display area most approaching the bonding area, and the second direction and the first direction are perpendicular to each other;
• and
• the protection layer comprises a first insulation layer and a second metal pattern layer arranged as stacked in sequence, and along a thickness direction of the base substrate, the first insulation layer is disposed on a side of the second metal pattern layer approaching the base substrate, wherein the second metal pattern layer is disposed in the non-bonding area, and the second metal pattern layer at least partially covers the signal leads.

An LCD apparatus, comprising:

• a circuit board to be bonded and a LCD panel;
• wherein the LCD panel comprises:
• an opposite substrate and an array substrate, and an LC layer disposed between the opposite substrate and the array substrate;
• wherein the array substrate comprises:
• a base substrate, a first metal pattern layer and a protection layer arranged as stacked in sequence;
• wherein the array substrate further comprises:
• a display area and a peripheral area surrounding the display area, the peripheral area comprises a bonding area and a non-bonding area, and the bonding area is disposed on at least one side outside the display area;
• the first metal pattern layer comprises a plurality of conductive contacts disposed in the bonding area and arranged at intervals along a first direction and a plurality of signal leads disposed in the non-bonding area and having a bent shape, one terminal of each of the conductive contacts approaching the display area is connected with corresponding one of the signal leads, the conductive contacts extend along a second direction and are configured to bond with gold fingers on a circuit board to be bonded, the first direction is parallel to an edge of the display area most approaching the bonding area, and the second direction and the first direction are perpendicular to each other;
• and
• the protection layer comprises a first insulation layer and a second metal pattern layer arranged as stacked in sequence, and along a thickness direction of the base substrate, the first insulation layer is disposed on a side of the second metal pattern layer approaching the base substrate, wherein the second metal pattern layer is disposed in the non-bonding area, and the second metal pattern layer at least partially covers the signal leads;
• and
• wherein the gold fingers are arranged on the circuit board to be bonded, the gold fingers are adapted to a shape of the conductive contacts disposed on the array substrate in the LCD panel, and the gold fingers are configured to bond with the conductive contacts.