Back to results
US 2024/0192480 A1Published application
Endoscope
AssigneeHoya Corporation
InventorHisanori BESSHO
Life of this patent
Estimating the term…
Abstract
To provide an endoscope capable of appropriately dissipating heat of a heat generating portion with a simpler configuration. In an endoscope including an image sensor that generates heat during operation, and a shield pipe and a mold resin portion that are integrated with the image sensor and dissipate heat transferred from the image sensor in a case where the image sensor generates heat, the mold resin portion has a linear expansion coefficient larger than those of the image sensor and the shield pipe.
Claims9
An endoscope comprising:
- a heat generating portion that generates heat during operation;
- and a heat dissipation member that dissipates heat transferred from the heat generating portion, wherein
- the heat dissipation member includes a first heat dissipation member that covers the heat generating portion and a second heat dissipation member with a cylindrical shape in which the first heat dissipation member is internally fitted, and
- the first heat dissipation member has a linear expansion coefficient larger than linear expansion coefficients of the heat generating portion and the second heat dissipation member.
1 more element
Dependencies are inferred from the claim text.