Multiphase thermal interface component, method of forming the same and electronic device testing apparatus provided with the same

A multiphase thermal interface component, comprising:

• a thermal interface solid element having a first thermal conductive surface and a second thermal conductive surface, wherein at least one surface among the first thermal conductive surface and the second thermal conductive surface has at least one accommodation space;
• and
• a thermal interface fluid material filled into the at least one accommodation space of the at least one surface;
• wherein the thermal interface solid element under ambient temperature is in a solid state:
• the thermal interface fluid material under ambient temperature is in liquid, gas, or gel state, or a combination of any two or three thereof.

An electronic device testing apparatus with multiphase thermal interface component, wherein the electronic device testing apparatus comprises:

• a thermal control device;
• a multiphase thermal interface component comprising a thermal interface solid element and a thermal interface fluid material, wherein the thermal interface solid element has a first thermal conductive surface and a second thermal conductive surface:
• at least one surface among the first thermal conductive surface and the second thermal conductive surface has at least one accommodation space;
• the thermal interface fluid material is filled into the at least one accommodation space of the at least one surface;
• and
• a socket configured to accommodate an electronic device under test;
• wherein the first thermal conductive surface of the thermal interface solid element is configured to contact the thermal control device, and the second thermal conductive surface of the thermal interface solid element is configured to contact the electronic device under test on the socket.