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US 2024/0191348 A1Published application
Semiconductor manufacturing apparatus and cleaning method of semiconductor manufacturing apparatus
AssigneeHitachi High-Tech Corporation
InventorsMasaki YAMADA, Aki TAKEI, Yosuke KUROSAKI, Takashi HATTORI
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Abstract
An object of the invention is to provide a technique that can decrease a reaction product or residual HF in a chamber. A semiconductor manufacturing apparatus includes an inlet to introduce a processing gas containing vapor of hydrogen fluoride and vapor of alcohol into a processing room in a processing container, a sample stage disposed in the processing room and having an upper surface on which a wafer to be processed is placed, and an introduction mechanism to introduce a polar molecular gas to the inlet.
Claims6
A semiconductor manufacturing apparatus, comprising:
- an inlet to introduce a processing gas containing vapor of hydrogen fluoride and vapor of alcohol into a processing room in a processing container;
- a sample stage disposed in the processing room and having an upper surface on which a wafer to be processed is placed;
- and
- an introduction mechanism to introduce a polar molecular gas to the inlet.
1 more element
Dependencies are inferred from the claim text.