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US 2024/0191344 A1Published application
Surface treatment method and substrate treatment device
AssigneeTokyo Electron Limited
InventorsHiroki MURAKAMI, Shuji AZUMO, Yumiko KAWANO
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Abstract
A surface processing method of removing a metal oxide film on a surface of a metal layer and a substrate processing apparatus are provided. The surface processing method for a substrate having a metal layer includes supplying a metal complex compound having a cyclopentadienyl ligand to a processing chamber and removing a metal oxide film on the surface of the metal layer using the metal complex compound.
Claims10
A surface processing method for a substrate having a metal layer, the method comprising:
- supplying a metal complex compound having a cyclopentadienyl ligand to a processing chamber;
- and
- removing a metal oxide film on a surface of the metal layer using the metal complex compound.
A substrate processing apparatus comprising:
- a processing container configured to accommodate a substrate having a metal layer;
- a supply configured to supply a metal complex compound having a cyclopentadienyl ligand to the processing container;
- and
- a controller,
- wherein the controller supplies the metal complex compound to the processing container to remove a metal oxide film on a surface of the metal layer.
2 more elements
Dependencies are inferred from the claim text.