Pressure-sensitive adhesive tape processing method and pressure-sensitive adhesive tape processing device

Abstract

Provided is a pressure-sensitive adhesive tape processing method capable of easily separating a base material and a pressure-sensitive adhesive for forming a pressure-sensitive adhesive tape from each other at low cost. Furthermore, a pressure-sensitive adhesive tape processing device used for such a pressure-sensitive adhesive tape processing method is provided. The pressure-sensitive adhesive tape processing method according to an embodiment of the present invention is a method for processing a pressure-sensitive adhesive tape including a base material layer and a pressure-sensitive adhesive layer, a storage modulus of the base material layer at 25° C. is 2 MPa or more, and the pressure-sensitive adhesive tape processing method includes a step (I) of separating a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, from the base material layer, by grinding a surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape.

Dependencies are inferred from the claim text.