Curable resin composition, dry film, cured product, and electronic component
AssigneeTaiyo Holding Co., Ltd.
InventorsDaisuke SHIBATA, Chiho UETA, Fumitaka KATO, Sawako SHIMADA, Shotaro TANE
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AssigneeTaiyo Holding Co., Ltd.
InventorsDaisuke SHIBATA, Chiho UETA, Fumitaka KATO, Sawako SHIMADA, Shotaro TANE
Estimating the term…
Provided are a curable resin composition, a dry film, a cured product, and an electronic component including the same that have excellent resolution, higher insulation reliability, and excellent embeddability in a circuit. A curable resin composition includes: (A) a carboxyl group-containing resin; (B) a photopolymerization initiator; (C) a thermosetting resin; and (D) silica, wherein a blending amount of (D) the silica is 10 to 60% by mass relative to a total solid content of the curable resin composition, (D) the silica includes (D-1) nanosilica, (D-1) the nanosilica has an average secondary particle size of 200 nm or less, and a degree of association of (D-1) the nanosilica is 2.3 or less.
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