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US 2024/0191071 A1Published application
Curable Composition
AssigneeLG Chem, Ltd.
InventorsJeong Hyun Lee, Do Yeon Kim, Yang Gu Kang, Shin Hee Jun, Ha Na Lee, Ho Yeon Son
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Abstract
A resin composition comprising an oil-modified polyol component, and a filler, or a cured product thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized, are described herein.
Claims20
A resin composition comprising an oil-modified polyol component, and a filler.
A two-component composition comprising:
- a main part comprising a polyol component and a filler;
- and
- a curing agent part comprising a curing agent component and a filler, and
- forming a cured product having adhesion force to aluminum of 0.1 N/mm2 or less, or having adhesion force to a polyester surface of 100 gf/cm or less.
1 more element
Dependencies are inferred from the claim text.