Composition of heat-expandable microspheres and use thereof

Abstract

A composition of heat-expandable microspheres and an application thereof are provided. The composition includes heat-expandable microspheres and a solvent. The particle size of the heat-expandable microspheres is 5 μm≤D≤40 μm, preferably 8 μm≤D≤20 μm. The thickness of the walls of at least 60% of the heat-expandable microspheres is ≤5 μm, preferably the thickness is ≤3 μm. The solvent at least comprises one organic solvent having a boiling point of above 220° C. A thermal expansion coating containing the composition has a stable structure, relatively high resistance to thermal shrinkage, relatively high mechanical strength and adhesion, can be applied in the fixation of high temperature resistant parts, and can maintain the bonding stability thereof when placed long-term in a high temperature environment (140-180° C.).

Dependencies are inferred from the claim text.