Composition for manufacturing polyimide film and polyimide film for flexible metal clad laminate manufactured using the same
AssigneeNexFlex Co., Ltd.
InventorsSo Jeong KIM, Joo Young KIM, Hyuk Jun KIM
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Abstract
The present disclosure relates to a composition for manufacturing a polyimide film and a polyimide film for a flexible metal clad laminate manufactured using the same. According to an aspect of the present disclosure, there is provided a composition for manufacturing a polyimide film, the composition comprising: an aromatic dianhydride; a diamine; and a curing catalyst, wherein the curing catalyst includes one or more selected from the group consisting of an imidazole-based compound, a quinolone-based compound, and a quinoline-based compound.
Claims17
A composition for manufacturing a polyimide film, the composition comprising:
- an aromatic dianhydride;
- a diamine;
- and a curing catalyst,
- wherein the curing catalyst includes one or more selected from the group consisting of an imidazole-based compound, a quinolone-based compound, and a quinoline-based compound.
A method for preparing a composition for manufacturing a polyimide film, the method comprising steps of:
- preparing a diamine solution by dissolving a diamine in an organic solvent;
- and
- injecting an aromatic dianhydride and a curing catalyst into the diamine solution,
- wherein the curing catalyst includes one or more selected from the group consisting of an imidazole-based compound, a quinolone-based compound, and a quinoline-based compound.
A polyimide film for a flexible metal clad laminate, which is manufactured from a composition for manufacturing a polyimide film, the composition comprising:
- an aromatic dianhydride;
- a diamine;
- and a curing catalyst, and which has a Young's modulus of 5 GPa or less and a coefficient of thermal expansion (CTE) of 15 ppm/K or less.
Dependencies are inferred from the claim text.