Back to results
US 2024/0191019 A1Published application
Curable Composition
AssigneeLG Chem, Ltd.
InventorsJeong Hyun Lee, Yang Gu Kang
Life of this patent
Estimating the term…
Abstract
A resin composition comprising a polyol component, and a filler, and a use thereof are described. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized.
Claims19
A curable composition comprising a polyol component, and a filler, and
- forming a cured product having a curvature radius of 20 mm or less.
A two-component composition comprising:
- a main part comprising a polyol component and a filler;
- and
- a curing agent part comprising a curing agent component and a filler, and
- forming a cured product having a curvature radius of 20 mm or less.
1 more element
Dependencies are inferred from the claim text.