Back to results
US 2024/0190132 A1Published application
Wafer, and liquid ejection chip
AssigneeCanon Kabushiki Kaisha
InventorsRYOTARO MURAKAMI, MANABU OTSUKA, MASAYA UYAMA
Life of this patent
Estimating the term…
Abstract
An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.
Claims8
A wafer comprising:
- a first substrate in which a groove is formed;
- a second substrate which is joined by an adhesive agent to a surface of the first substrate where the groove is formed, and in which an opening is formed at a position where the opening overlaps the groove in the state where the first substrate and the second substrate are joined to each other;
- and
- an adhesive agent accumulation portion at which the adhesive agent coming out of a gap between the first substrate and the second substrate accumulates and stays away from a bottom of the groove, wherein
- the wafer is to be cut along the groove and the opening.
2 more elements
A liquid ejection chip formed by cutting a wafer comprising:
- a first substrate in which a groove is formed;
- and
- a second substrate which is joined by an adhesive agent to a surface of the first substrate where the groove is formed, and in which an opening is formed at a position where the opening overlaps the groove in the state where the first substrate and the second substrate are joined to each other;
- an adhesive agent accumulation portion at which the adhesive agent coming out of a gap between the first substrate and the second substrate accumulates and stays away from a bottom of the groove;
- an energy generation element which is formed on a front surface of the first substrate and generates an energy for ejecting a liquid;
- a channel layer in which is formed a channel for guiding the liquid supplied from a through-hole in the first substrate to the energy generation element;
- and
- a nozzle layer in which an ejection port for ejecting the liquid is formed, wherein
- the wafer is to be cut along the groove and the opening, and
- the liquid ejection chip is formed by cutting the wafer along the groove and the opening.
7 more elements
A liquid ejection chip comprising:
- a first substrate in which energy generation elements for generating an energy for ejecting a liquid are arrayed;
- a second substrate joined by an adhesive agent to a second surface of the first substrate opposite to a first substrate thereof on which the energy generation elements are formed;
- and
- an adhesive agent accumulation portion at which the adhesive agent coming out of a gap between the first substrate and the second substrate accumulates and stays away from a side surface of the first substrate in a direction crossing an array direction of the energy generation elements, wherein
- the liquid ejection chip is formed by cutting the side surface of the first substrate.
2 more elements
Dependencies are inferred from the claim text.