Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKosuke TSUDA, Hirosuke SAITO, Yasunori NISHIGUCHI, Hiroharu INOUE
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Abstract
An aspect of the present invention is a resin composition containing at least one of a polyphenylene ether compound (A), having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, and a maleimide compound (B); and ceramic particles (C) including aluminum titanate particles (C1). In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.
Claims16
A resin composition comprising:
- at least one of a polyphenylene ether compound (A), having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a maleimide compound (B);
- and
- ceramic particles (C) including aluminum titanate particles (C1),
- [in Formula (1), p represents 0 to 10, Ar represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group],
- [in Formula (2), R4 represents a hydrogen atom or an alkyl group].
Dependencies are inferred from the claim text.