Method for producing multilayer body, and multilayer body
AssigneeDaikin Industries, Ltd.
InventorsTakashi NAMIKAWA, Chihiro Nakagawa, Takayuki Matsunaga
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Abstract
A method for producing a laminate of two silicon substrates, which includes: (a) providing a first silicon substrate having a first bonding part and a second silicon substrate having a second bonding part, wherein the first bonding part and the second bonding part are portions containing a silicon oxide; and bonding the first bonding part and the second bonding part with a reaction product derived from an organic material reactive with a hydrosilyl group and/or a silanol group. Also disclosed is a laminate including the two silicon substrates.
Claims14
A method for producing a laminate including two silicon substrates, comprising:
- (a) providing a first silicon substrate having a first bonding part and a second silicon substrate having a second bonding part, wherein the first bonding part and the second bonding part are portions containing a silicon oxide;
- and
- (b) using an organic material reactive with a hydrosilyl group and/or a silanol group to thereby bond the first bonding part and the second bonding part by a reaction product derived from the organic material.
A method for producing a laminate including two silicon substrates, comprising:
- (c) providing a first silicon substrate having a first foundation part and a first bonding part formed thereon and a second silicon substrate having a second foundation part and a second bonding part formed thereon, wherein the first foundation part and the second foundation part are portions containing silicon oxide, and the first bonding part and the second bonding part are silicon layers;
- and
- (d) bonding the first bonding part and the second bonding part directly, or using a hydrosilyl group present on a surface of at least one of the first bonding part and the second bonding part.
A laminate comprising two silicon substrates, comprising:
- a first silicon substrate having a first bonding part;
- a second silicon substrate having a second bonding part;
- and
- a bonding layer bonding the first bonding part to the second bonding part,
- wherein the first bonding part and the second bonding part are portions containing silicon oxide, and the bonding layer contains an organic substance chemically bound to Si atoms of the first bonding part and Si atoms of the second bonding part.
A laminate comprising two silicon substrates, comprising:
- a first silicon substrate having a first bonding part;
- a second silicon substrate having a second bonding part;
- a bonding layer bonding the first bonding part to the second bonding part,
- wherein the first bonding part and the second bonding part are portions containing silicon oxide, and the bonding layer contains an organic substance and has a thickness of 10 nm or less.
A laminate comprising two silicon substrates, comprising:
- a first silicon substrate having a first foundation part and a first bonding part formed thereon;
- a second silicon substrate having a second foundation part and a second bonding part formed thereon;
- wherein the first foundation part and the second foundation part are portions containing silicon oxide, the first bonding part and the second bonding part are silicon layers, and the first bonding part and the second bonding part are directly bonded, or bonded using a hydrosilyl group present on a surface of at least one of the first bonding part and the second bonding part.
Dependencies are inferred from the claim text.