Bond assembly jig preparation methods using thermosetting bismaleimide resins

A method for preparing a bond assembly jig (BAJ), comprising:

• forming a cutter relief groove in the BAJ, wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ;
• cleaning the cutter relief groove with a solvent;
• after said cleaning, filling the cutter relief groove of the BAJ with a material, wherein the material comprises a bismaleimide (BMI) resin;
• covering an exposed surface of the material with a release film and a caul sheet;
• curing the material after said filling after said covering;
• and
• laying up a part on the BAJ after said curing.

A method for preparing a bond assembly jig (BAJ), comprising:

• forming a cutter relief groove in the BAJ, wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ;
• cleaning the cutter relief groove with a solvent;
• after said cleaning, over-filling the cutter relief groove of the BAJ with a material, wherein the material comprises a plurality of overlaid strips formed of bismaleimide (BMI) resin;
• covering an exposed surface of the material with a release film and a caul sheet;
• sealing outer perimeter edges of the caul sheet with a tape;
• curing the material after said filling after said covering;
• laying up a part on the BAJ after said curing;
• forming a groove in the part and the material, wherein the portion of the groove formed in the material provides a sub-groove;
• removing the part from the BAJ after said forming the groove;
• and
• depositing preg material into the sub-groove after said removing.