Additive manufacturing systems and methods for the same
AssigneeXerox Corporation
InventorsPatrick Y. Maeda, Daniel Bullard, Dogan Timucin
Life of this patent
Estimating the term…
Abstract
An additive manufacturing device includes a stage configured to support a substrate. The device also includes a printhead disposed above the stage. The printhead is configured to heat a build material to a molten build material and to deposit the molten build material on the substrate in the form of droplets to fabricate an article. The device also includes a controlled heating and ablation system disposed proximal the printhead. The controlled heating and ablation system is configured to heat the substrate and ablate oxides on a surface of the substrate.
Claims21
An additive manufacturing device, comprising:
- a stage configured to support a substrate;
- a printhead disposed above the stage, the printhead configured to heat a build material to a molten build material and deposit the molten build material on the substrate in the form of droplets to fabricate an article;
- and
- a controlled heating and ablation system disposed proximal the printhead, wherein the controlled heating and ablation system is configured to heat the substrate and ablate oxides on a surface of the substrate.
An additive manufacturing device, comprising:
- a stage configured to support a substrate;
- a printhead disposed above the stage, the printhead configured to heat a build material to a molten build material and deposit the molten build material on the substrate in the form of droplets to fabricate an article;
- a controlled heating and ablation system disposed proximal the printhead, wherein the controlled heating and ablation system comprises a laser, wherein an output from the laser comprises:
- a power of from about 40 watts (W) to about 1500 W,
- an irradiance of from about 1 W/cm2 to about 10,000 W/mm2,
- a wavelength of from about 355 nm to about 1200 nm,
- a fluence (F) of from about 0.1 J/cm2 to about 50 J/cm2,
- a pulse energy of from about 1 microjoule (μJ) to about 50 millijoules (mJ),
- a pulse repetition rate of from about 5 kHz to about 250 MHz,
- a pulse width of from about 0.5 ns to about 100 ms,
- a pulse duration that is lower than a thermal relaxation time of the substrate to minimize a temperature increase of the substrate,
- wherein the output is configured to concurrently heat the substrate and ablate oxides on a surface of the substrate, and wherein an area on the surface that is heated by the output has a diameter of from about 0.025 mm to about 2.0 mm;
- a monitoring system configured to monitor a temperature of the substrate;
- and
- a computing system configured to adjust the controlled heating and ablation system based on the temperature of the substrate provided by the monitoring system.
Dependencies are inferred from the claim text.