Smart desoldering device and method for laser removal of substrate solder mask driven by artificial intelligence

A smart desoldering method for laser removal of substrate solder mask driven by artificial intelligence, which is used to process at least one substrate placed in a laser processing machine through an energy controllable laser, wherein each said substrate corresponds to a panel production part number, and desoldering is performed through a smart desoldering device, said smart desoldering device comprising an artificial intelligence system, a control processing module, a camera module, a laser desoldering module and an alignment module, said artificial intelligence system comprising a database unit, a learning and training unit, a parameter optimization setting unit, a condition restriction unit and an AI model processing unit, said learning and training unit being connected to said database unit, said parameter optimization setting unit being connected to said database unit, said condition restriction unit being connected to said learning and training unit, said AI model processing unit being connected to said learning and training unit and said parameter optimization setting unit, said control processing module being connected to said AI model processing unit of said artificial intelligence system, said camera module being connected to said control processing module, said laser desoldering module being connected to said control processing module, said alignment module being connected to said control processing module, the smart desoldering method for laser removal of substrate solder mask driven by artificial intelligence comprising the steps of:

• Step S501:
• setting multiple conditions through said condition restriction unit to limit the learning bias of said artificial intelligence (AI) system;
• Step S502:
• through said learning and training unit, performing learning and pre-training according to a substrate deep learning algorithm and based on relevant data in said database unit, which has relevant information on types of substrates, sizes of substrates, thicknesses of substrates, colors of solder mask, thickness of solder mask and depth around solder pads;
• Step S503:
• said AI model processing unit learning and training an AI model through said learning and training unit, where said AI model processing unit is the AI brain of said artificial intelligence system;
• Step S504:
• providing a substrate with a solder pad on the surface of said substrate;
• Step S505:
• covering the surface of said substrate and said solder pad with a solder mask, where said solder mask has a shielding part facing the surface of said substrate, and a clearing part facing said solder pad;
• Step S506:
• said alignment module using an infrared light to align said substrate to be processed to further adjust the expansion and contraction of the construction pattern, where the infrared light is used to see through said solder mask, and said artificial intelligence (AI) system analyzes and eliminates unsuitable alignment point images, and calculates the deformation direction and degree of said substrate;
• Step S507:
• reading the quick response matrix pattern of the panel production part number on said substrate through said camera module, and sending the read quick response matrix pattern back to said AI model processing unit to identify the characteristics of said substrate, and performing pre-processing preparations for parameter optimization settings;
• Step S508:
• through said parameter optimization setting unit, performing optimized settings of multiple processing parameters according to the relevant information of the type of said substrate, the size of said substrate, the thickness of said substrate, the color of said solder mask, the thickness of said solder mask and the depth around said solder pad;
• Step S509:
• said laser desoldering module performing laser desoldering on said substrate according to a first control command and a circuit layout diagram sent by said control processing module.
• Step S510:
• using a laser beam to peel off said clearing part according to a construction pattern, so that said solder mask forms at least one hollow part, in which said circuit layout diagram imports the data of said solder mask, and then the data of said solder mask is converted into positive images, negative images or graphics to obtain the construction pattern.
• Step S511:
• photographing said substrate through said camera module and taking out a substrate processing picture;
• Step S512:
• comparing and determining whether said substrate processing picture and said circuit layout diagram are the same.
• Step S513:
• completing the substrate processing operation if said substrate processing picture and said circuit layout diagram are the same;
• and
• Step S514:
• said laser beam peeling off said clearing part based on the differences if said substrate processing picture and said circuit layout diagram are not the same.