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US 2024/0189903 A1Published application
Molded body, method of producing molded body, and method of producing sintered body
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsMotohiro FUKAI, Kuon MIYAZAKI
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Abstract
A molded body that can suppress plastic deformation during conveyance is provided. A molded body according to the present disclosure is a molded body containing a sinterable inorganic powder and an organic binder, wherein the bending modulus (MPa) upon 0.05% to 0.1% strain of the above molded body is 4000 to 15000, and the bending yield strength (MPa) is 10 or more.
Claims15
A molded body comprising a sinterable inorganic powder and an organic binder,
- wherein a bending modulus (MPa) upon 0.05% to 0.1% strain of the molded body is 4000 to 15000, and
- a bending yield strength (MPa) is 10 or more.
A method of producing a molded body comprising a sinterable inorganic powder and an organic binder, the method comprising:
- a kneading step of kneading the sinterable inorganic powder and the organic binder to obtain a kneaded product;
- and
- a molding step of molding the kneaded product to obtain a molded body,
- wherein a bending modulus (MPa) upon 0.05% to 0.1% strain of the molded body is 4000 to 15000, and
- a bending yield strength (MPa) is 10 or more.
2 more elements
Dependencies are inferred from the claim text.