Method for manufacturing organic semiconductor element

A method for manufacturing an organic semiconductor element, comprising:

• a first process of preparing a substrate having a main surface;
• a second process of forming a first terminal on the main surface at least after the first process;
• a third process of forming a first electrode to be electrically connected to the first terminal on the main surface at least after the first process;
• a fourth process of forming an organic semiconductor layer on the first electrode at least after the third process;
• a fifth process of forming a second electrode on the organic semiconductor layer at least after the fourth process;
• a sixth process of forming a sacrificial layer made of an organic material identical to the organic semiconductor layer in a predetermined region on the main surface at least after the first process;
• a seventh process of forming a barrier layer on the main surface by an ALD method to cover the first terminal, the first electrode, the second electrode, the organic semiconductor layer, and the sacrificial layer after the second process, the fifth process, and the sixth process;
• and
• an eighth process of removing the sacrificial layer and a portion of the barrier layer after the seventh process, the portion covering the sacrificial layer,
• wherein the organic semiconductor layer and the sacrificial layer are apart from each other after the second process, the fifth process, and the sixth process and before the seventh process.