Semiconductor memory device and manufacturing method thereof
AssigneeSK hynix Inc.
InventorDong Hwan LEE
Life of this patent
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Abstract
There are provided a semiconductor memory device and a manufacturing method thereof. The semiconductor memory device includes: a gate stack structure including interlayer insulating layers and conductive patterns, which are alternately stacked in a vertical direction on a substrate; a plurality of channel structures penetrating the gate stack structure, each of the plurality of channel structures with one end portion protruding past a boundary of the gate stack structure; and a source layer formed on the gate stack structure. The protruding end portion of each of the plurality of channel structures extends into the source layer. The protruding end portion of each of the plurality of channel structures has a flat section.
Claims9
A semiconductor memory device comprising:
- a gate stack structure including interlayer insulating layers and conductive patterns, which are alternately stacked in a vertical direction on a substrate;
- a plurality of channel structures penetrating the gate stack structure, each of the plurality of channel structures with one end portion protruding past a boundary of the gate stack structure;
- and
- a source layer formed on the gate stack structure,
- wherein the protruding end portion of each of the plurality of channel structures extends into the source layer, and
- wherein the protruding end portion of each of the plurality of channel structures has a flat section.
Dependencies are inferred from the claim text.