Wafer level package and method of manufacture
AssigneeRF360 Singapore Pte. Ltd.
InventorMarkus SCHIEBER
Life of this patent
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Abstract
A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer.
Claims15
A method of manufacturing a wafer level package, comprising:
- forming a hole in a cap wafer;
- filling the hole with a metal to form a via;
- forming a structured metallization layer in contact with the metal, the structured metallization including a first contact pad in contact with the metal;
- bonding the first contact pad to a second wafer such that a first surface of the cap wafer faces the second wafer;
- and
- grinding the cap wafer from a second surface of the cap wafer opposite the first surface to expose the metal filled hole.
Dependencies are inferred from the claim text.