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US 2024/0186280 A1Published application
Thermocompression bonding tool for panel-level thermo-compression bonding
AssigneeIntel Corporation
InventorsMinglu LIU, Andrey GUNAWAN, Gang DUAN, Edvin CETEGEN, Yuting WANG, Mine KAYA, Kartik SRINIVASAN, Mihir OKA, Anurag TRIPATHI
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Abstract
The present disclosure is directed to an apparatus having a bond head configured to heat and compress a semiconductor package assembly, and a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.
Claims20
An apparatus, comprising:
- a bond head configured to heat and compress a semiconductor package assembly;
- and
- a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.
A method comprising:
- providing an apparatus, the apparatus comprising a bond head configured to heat and compress a semiconductor package assembly and a bonding stage comprising a ceramic material including silicon and either magnesium or indium;
- and
- holding the semiconductor package assembly using the bonding stage.
A method comprising:
- providing an apparatus, the apparatus comprising a bond head configured to heat and compress a semiconductor package assembly and a bonding stage comprising a ceramic material including silicon and either magnesium or indium;
- providing the semiconductor package assembly comprising a plurality of semiconductor packages and a semiconductor panel to undergo a thermocompression bonding process;
- and
- positioning each of the plurality of semiconductor packages on the bonding stage.
1 more element
Dependencies are inferred from the claim text.