Semiconductor packaging substrate, semiconductor packages, and method for manufacturing the semiconductor packaging substrate
AssigneeAbsolics Inc.
InventorSungjin KIM
Life of this patent
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Abstract
Embodiments relate to a semiconductor packaging substrate, a semiconductor packages, and a method for manufacturing the semiconductor packaging substrate, wherein a substrate comprising a one surface, other surface facing the one surface, a recessed surface that the one surface recessed, and a side wall connecting the one surface and the recessed surface; and plurality of first vias that penetrating the recessed surface and the other surface; wherein the plurality of first vias include a thermally conductive material. Embodiments have an excellent heat dissipation effect and can prevent warpage on the surface of the substrate due to thermal expansion.
Claims11
A semiconductor packaging substrate comprising:
- a substrate comprising a one surface, other surface facing the one surface, a recessed surface that the one surface recessed, and a side wall connecting the one surface and the recessed surface;
- and
- plurality of first vias that penetrating the recessed surface and the other surface,
- wherein the plurality of first vias comprise a thermal conductive material.
A semiconductor packages comprising:
- a substrate comprising a one surface, other surface facing the one surface, a recessed surface that the one surface recessed, and a side wall connecting the one surface and the recessed surface;
- plurality of first vias that penetrating the recessed surface and the other surface;
- and
- an element unit disposed on the recessed surface,
- wherein the plurality of first vias comprise a thermal conductive material.
A method for manufacturing the semiconductor packaging substrate comprising:
- a preparation operation of forming a defect at a predetermined location on a one surface of a substrate, other surface facing the one surface, or both,
- a via forming operation of applying an etchant to the substrate to form a plurality of vias and recessed surface, and
- a filling operation of filling the plurality of vias with a thermal conductive material.
Dependencies are inferred from the claim text.