US 2024/0186221 A1 · SEMICONDUCTOR DEVICE

Abstract

A semiconductor device with front and back surfaces, and a side surface having first and second sides opposite to each other, and third and fourth sides opposite to each other. The semiconductor device includes a plurality of circuit boards surrounded by the first to fourth sides, the circuit boards each including an insulating board and a conductive plate, a first lead frame including a first terminal portion extending upward and being bent toward the first side, a second lead frame including a second terminal portion extending upward and being bent toward the second side, and a resin-filled portion provided in a first gap between the first terminal portion and the second terminal portion, the resin-filled portion having a concave portion recessed in a direction from the front surface toward the back surface so that an insulating insertion member is inserted into the concave portion.

Claims33

Dependent claims

A semiconductor device having a front surface and a back surface facing each other, and having an outer side surface having a first side, a second side facing the first side, a third side, and a fourth side facing the third side, the semiconductor device comprising:

a plurality of semiconductor elements;
a plurality of circuit boards surrounded by the first to fourth sides, each of the circuit boards including an insulating board and a conductive plate disposed on the insulating board, each of the plurality of semiconductor elements being disposed on the conductive plate of each of the circuit boards;
a first lead frame at one side thereof electrically connected to one of the semiconductor elements, and at another side thereof including a first terminal portion extending upward and being bent toward the first side;
a second lead frame at one side thereof electrically connected to another one of the semiconductor elements, and another side thereof including a second terminal portion extending upward and being bent toward the second side surface;
and
a resin-filled portion provided in a first gap between the first terminal portion and the second terminal portion, the resin-filled portion having a concave portion recessed in a direction from the front surface toward the back surface so that an insulating insertion member is inserted into the concave portion.

3 more elements

A semiconductor device having a front surface and a back surface facing each other, and an outer side surface having a first side, a second side facing the first side, a third side, and a fourth side facing the third side, the semiconductor device comprising:

a plurality of semiconductor elements;
a plurality of circuit boards surrounded by the first side, the second side, the third side, and the fourth side, each of the circuit boards including an insulating board and a conductive plate disposed on the insulating board, each of the plurality of the semiconductor elements being disposed on the conductive plate of each of the circuit boards;
a first lead frame at one side thereof electrically connected to one of the semiconductor elements, and at another side thereof including a first terminal portion extending upward and being bent toward the first side;
a second lead frame at one side thereof electrically connected to another one of the semiconductor elements, and at another side thereof including a second terminal portion extending upward and being bent toward the second side;
and
a resin-filled portion provided in a first gap between the first terminal portion and the second terminal portion, wherein
the first read frame and the second read frame are disposed such that the first lead frame and the second lead frame overlap each other at a superimposed area of the second lead frame in a plan view of the semiconductor device, in the superimposed area, a current flowing through the first lead frame in a direction that is opposite to a direction of a current flowing through the second lead frame when a switching operation of the semiconductor device is implemented, and
the first gap, in a direction parallel to the front surface of the semiconductor device, between the first terminal portion and the second terminal portion is greater than a second gap in a direction orthogonal to the front surface of the semiconductor device between the first lead frame and the second lead frame in the superimposed area.

5 more elements

A semiconductor device, comprising:

a semiconductor element having a first front surface;
a first substrate including
a first insulating board having a second front surface parallel to the first front surface of the semiconductor element, and
a first conductive plate that is disposed on the second front surface of the first insulating board, the semiconductor element being disposed on the first conductive plate at a first side opposite to a second side in which the first insulating board is disposed;
a second substrate including a second insulating board having a third front surface parallel to the first front surface of the semiconductor element, and
a second conductive plate that is disposed on the third front surface of the second insulating board;
and
a wiring unit, including
a first lead frame, electrically connected to the first conductive plate and having a first wiring portion disposed parallel to the first front surface of the semiconductor element and the second front surface of the first insulating board and away from the first front surface of the semiconductor element such that a first gap is formed with no element between the first lead frame and the semiconductor element,
a second lead frame, electrically connected to the second conductive plate and having a second wiring portion above the first lead frame and overlapping the first wiring portion in a plan view of the semiconductor device at a superimposed area of the second lead frame, a second gap between the first lead frame and the second lead frame being formed in the superimposed area in a direction orthogonal to the second front surface of the first insulating board, and
a wiring holding portion holding the first lead frame and the second lead frame, the wiring holding portion including
a wiring gap portion that fills in the second gap in the superimposed area, and
a wiring surface portion disposed over the second wiring portion in the superimposed area.

10 more elements

A semiconductor device, comprising:

a semiconductor element;
a first substrate that includes
a first insulating board having a first front surface, and
a first conductive plate that is disposed on the first front surface of the first insulating board, the semiconductor element being disposed on the first conductive plate at a first side opposite to a second side in which the first insulating board is disposed;
a second substrate that includes
a second insulating board having a second front surface, and
a second conductive plate that is disposed on the second front surface of the second insulating board, and
a wiring unit including
a first lead frame, electrically connected to the first conductive plate and having a first wiring portion wired parallel to the first front surface of the first insulating board,
a second lead frame, electrically connected to the second conductive plate and having a second wiring portion above the first lead frame and overlapping the first wiring portion in a plan view of the semiconductor device at a superimposed area of the second lead frame, a gap between the first lead frame and the second lead frame being formed in the superimposed area in a direction orthogonal to the first front surface of the first insulating board, and
a wiring holding portion holding the first lead frame and the second lead frame, the wiring holding portion including
a wiring gap portion which fills in the gap in the superimposed area, and
a wiring surface portion disposed over the second wiring portion in the superimposed area;
a case that surrounds the first and second substrates;
and
a sealing member with which the case is filled so that an upper surface of the sealing member is positioned just under a back surface of the first wiring portion, and with which the first and second substrates and the semiconductor element are sealed, the back surface of the first wiring portion being opposite to a front surface of the first wiring portion that faces the second wiring portion, wherein
an interface gap is formed between the first wiring portion and the sealing member.

14 more elements

A semiconductor device, comprising:

a semiconductor element;
a first substrate that includes
a first insulating board having a first front surface, and
a first conductive plate that is disposed on the first front surface of the first insulating board, the semiconductor element being disposed on the first conductive plate at a first side opposite to a second side in which the first insulating board is disposed;
a second substrate that includes
a second insulating board having a second front surface, and
a second conductive plate that is disposed on the second front surface of the second insulating board;
and
a wiring unit, including
a first lead frame, electrically connected to the first conductive plate and having a first wiring portion wired parallel to the first front surface of the first insulating board,
a second lead frame, electrically connected to the second conductive plate and having a second wiring portion above the first lead frame and overlapping the first wiring portion in a plan view of the semiconductor device at a superimposed area of the second lead frame, a gap between the first lead frame and the second lead frame being formed in the superimposed area in a direction orthogonal to the first front surface of the first insulating board, and
a wiring holding portion holding the first lead frame and the second lead frame, the wiring holding portion including
a wiring gap portion that fills in the gap in the superimposed area, and
a wiring surface portion disposed over the second wiring portion in the superimposed area;
a case that surrounds the first and second substrates;
a sealing member with which the case is filled so that an upper surface of the sealing member is positioned just under a back surface of the first wiring portion, and with which the first and second substrates and the semiconductor element are sealed, the back surface of the first wiring portion being opposite to a front surface of the first wiring portion that faces the second wiring portion;
and
a lid portion disposed over the case, wherein
the first lead frame further includes a first bonding portion and a first terminal portion, the first wiring portion being disposed between the first bonding portion and the first terminal portion, the first bonding portion being electrically connected to the first conductive plate, the first terminal portion extending in a direction away from the substrate,
the second lead frame includes a second bonding portion and a second terminal portion, the second wiring portion being disposed between the second bonding portion and the second terminal portion,
the second bonding portion is electrically connected to the second conductive plate and the second terminal portion extends away from the substrate, and
the first terminal portion and the second terminal portion each are arranged from inside the case to be exposed outside the lid portion.

19 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims33