Package with underfill containment barrier

A system, comprising:

• a display subsystem;
• a wireless communication interface;
• and
• an integrated circuit package, the integrated circuit package comprising:
• a substrate;
• a first die and a second die on a surface of the substrate, the second die laterally spaced apart from the first die;
• an interconnect bridge coupled to the substrate, the interconnect bridge beneath the first die and the second die, and the interconnect bridge coupled to the first die and the second die;
• a metal structure on the surface of the substrate, the metal structure extending away from the surface of the substrate, and the metal structure laterally surrounding the first die and the second die;
• and
• a dielectric material laterally between the metal structure and the first die or the second die, wherein the dielectric material does not extend beyond the metal structure.