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US 2024/0186136 A1Published application
Polymeric films as an adhesive promotion/buffer layer at glass-dielectric or metal-dielectric interfaces
AssigneeIntel Corporation
InventorsMahdi Mohammadighaleni, Whitney M. Bryks, Shayan Kaviani, Joshua J. Stacey, Thomas S. Heaton
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Abstract
In one embodiment, an integrated circuit apparatus (e.g., package substrate) includes a polymeric layer between a metal and a dielectric or between a metal and a glass. The polymeric layer may be conformally deposited using a vacuum-based vapor deposition technique, e.g., initiated chemical vapor deposition (iCVD).
Claims20
An apparatus comprising:
- a substrate;
- metal pillars on a first side of the substrate;
- a polymeric layer conformally on the metal pillars;
- and
- a dielectric layer on the polymeric layer.
2 more elements
An integrated circuit package substrate comprising:
- a core layer;
- metal vias electrically coupling a first side of the core layer and a second side of the core layer;
- and
- a polymeric layer between the metal vias and the core layer.
1 more element
A method comprising:
- forming a plurality of holes in a substrate comprising Silicon and Oxygen;
- depositing a polymer material on the sidewalls of the holes;
- and
- depositing a metal in the holes.
1 more element
Dependencies are inferred from the claim text.