Scalable Thermalization of Wiring and Attenuation of Signals for Quantum Devices within Quantum Computing Systems
AssigneeGoogle Inc.
InventorsBob Benjamin Buckley, Mike Hamilton
Life of this patent
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AssigneeGoogle Inc.
InventorsBob Benjamin Buckley, Mike Hamilton
Estimating the term…
The disclosure is directed to a quantum processor system. The system includes a first cryogenic chamber, a signal reflector element positioned within the first chamber, a second cryogenic chamber, and a quantum device positioned in the second chamber. The signal reflector element is configured to split an input signal into a first signal component and a second signal component. The system further includes a first signal line and a second signal line. The first signal line is configured to provide the input signal from an external environment to the signal reflector element and to provide the reflected first signal component from the signal reflector element to the external environment. The second signal line is configured to provide the transmitted second signal component from the signal reflector element to the quantum device. The signal reflector element electrically couples the first signal line to the second signal line.
A quantum computing system comprising:
A cryogenic system comprising:
Dependencies are inferred from the claim text.