Plating apparatus

Abstract

Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanism 460 configured to support an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assembly 470 arranged on a back surface side of the surface to be plated Wf-a of the substrate Wf and configured to sandwich the substrate Wf with the supporting mechanism 460, and a removing mechanism 471 configured to provide a force that removes the substrate Wf from the back plate assembly 470 to a back surface of the surface to be plated Wf-a of the substrate Wf.

Dependencies are inferred from the claim text.