Adhesive precursor composition and heat-expandable temporary adhesive therefrom

Abstract

The present disclosure provides an adhesive precursor composition, comprising a polyfunctional acrylate oligomer, a reactive diluent including an acrylate monomer; a photoinitiator, and heat-expandable microspheres which are capable of expanding above an expansion initiation temperature, Ti, wherein the adhesive precursor composition is a liquid at temperature, Ta, wherein Ta is less than Ti, and the reaction product of the adhesive precursor composition is a heat-expandable temporary adhesive having a maximum value of tan δ at a temperature, Ttan δ max, wherein Ttan δ max is less than Ti. In another aspect, the present disclosure provides a heat-expandable temporary adhesive including the reaction product of an adhesive precursor composition according to any one of the adhesive precursor compositions of the present disclosure.

Dependencies are inferred from the claim text.