Curable Composition
AssigneeLG Chem, Ltd.
InventorsJeong Hyun Lee, Yang Gu Kang, Do Yeon Kim
Life of this patent
Estimating the term…
Abstract
A resin composition comprising a polyol component comprising a first polyol compound containing a linear or branched hydrocarbon group having 3 or more carbon atoms bonded to a polyester skeleton or a polyether skeleton, and a second polyol compound without the linear or branched hydrocarbon group having 3 or more carbon atoms, and a use thereof are described herein. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized.
Claims18
A curable composition comprising a polyol component, and a filler, wherein the polyol component comprises a first polyol compound containing at least one linear or branched hydrocarbon group with 3 or more carbon atoms bonded to a polyester skeleton or a polyether skeleton, and a second polyol compound without the hydrocarbon group.
A two-component composition comprising:
- a main part comprising a polyol component and a filler;
- and
- a curing agent part comprising a curing agent and a filler, wherein the polyol component comprises a first polyol compound containing at least one linear or branched hydrocarbon group with 3 or more carbon atoms bonded to a polyester skeleton or a polyether skeleton, and a second polyol compound without the hydrocarbon group.
Dependencies are inferred from the claim text.