Micromechanical environmental barrier device

A micromechanical environmental barrier chip, comprising:

• a substrate having a first substrate surface and an opposite second substrate surface;
• a material layer on top of the first substrate surface, the material layer having a different etch characteristic than the substrate;
• a microstructured micromechanical environmental barrier structure on top of the material layer;
• and
• at least a first cavity opposite the micromechanical environmental barrier structure, wherein the material layer located inside the cavity is absent and the environmental barrier structure is exposed.

A micromechanical environmental barrier chip, comprising:

• a substrate having a first substrate surface and an opposite second substrate surface;
• a material layer deposited onto the first substrate surface, the material layer having a different etch characteristic than the substrate;
• a microstructured micromechanical environmental barrier structure deposited on top of the material layer;
• and
• at least a first cavity opposite the micromechanical environmental barrier structure, wherein the material layer located inside the cavity is absent and the environmental barrier structure is exposed, wherein the substrate is a wafer from which a plurality of micromechanical environmental barrier chips are produced.