Packaging structure
AssigneeWistron Neweb Corp.
InventorPIN-HSIU LAI
Life of this patent
Estimating the term…
Abstract
A packaging structure is provided. The packaging structure includes a protective film and at least one fixing strip. The protective film includes at least one opening, and the at least one fixing strip includes a bonding layer. The bonding layer is disposed on one side of the at least one fixing strip and is configured to attach the at least one fixing strip to the protective film corresponding to the at least one opening. A portion of the at least one fixing strip covers the protective film, and another portion of the at least one fixing strip covers the at least one opening.
Claims14
A packaging structure comprising:
- a protective film comprising:
- at least one opening;
- and
- at least one fixing strip comprising:
- a bonding layer disposed on one side of the at least one fixing strip and configured to attach the at least one fixing strip to the protective film corresponding to the at least one opening;
- wherein a portion of the at least one fixing strip covers the protective film, and another portion of the at least one fixing strip covers the at least one opening.
A packaging structure comprising:
- a protective film, configured to wrap a product and comprising:
- at least one opening corresponding to at least one region of the product;
- and
- at least one fixing strip comprising:
- a bonding layer disposed on one side of the at least one fixing strip and configured to attach the at least one fixing strip to the protective film and the product corresponding to the at least one opening;
- wherein a portion of the at least one fixing strip covers the protective film, and another portion of the at least one fixing strip covers the at least one opening of the protective film and the at least one region of the product.
Dependencies are inferred from the claim text.