Cutting device and cutting method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsRyuta ABE, Tatsuya MASADA, Masahide MARUYAMA
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Abstract
A cutting device is for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate, a first active material layer, and a second active material layer, the cutting device including: a process unit that causes a cutting blade to cut the first active material layer and the current collector plate; and a support unit that supports the continuous body, has a groove at a position facing the cutting blade, and is configured to peel a portion of the second active material layer that overlaps the groove.
Claims5
A cutting device for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate having a first surface and a second surface facing away from each other, a first active material layer laminated on the first surface, and a second active material layer laminated on the second surface, the cutting device comprising:
- a process unit that causes a cutting blade to advance from a side of the first active material layer, beyond the current collector plate, as far as a depth short of a surface of the continuous body toward the second active material layer, thereby cutting the first active material layer and the current collector plate;
- and
- a support unit that faces the process unit across the continuous body to support the continuous body, has a groove that is recessed in a direction away from the process unit at a position facing the cutting blade, and is configured to peel a portion of the second active material layer that overlaps the groove.
A cutting method for cutting a continuous body of an electrode plate, the electrode plate including a current collector plate having a first surface and a second surface facing away from each other, a first active material layer laminated on the first surface, and a second active material layer laminated on the second surface, the cutting method comprising:
- causing a cutting blade to advance from a side of the first active material layer, beyond the current collector plate, as far as a depth short of a surface of the continuous body toward the second active material layer, thereby cutting the first active material layer and the current collector plate;
- and
- supporting the continuous body from a side of the second active material layer by using a support unit having a groove, and aligning the groove with a position facing the cutting blade to peel a portion of the second active material layer that overlaps the groove.
Dependencies are inferred from the claim text.