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US 2024/0181572 A1Published application
Dry method for metal-defined pad formation
AssigneeIntel Corporation
InventorsTchefor NDUKUM, Deniz TURAN, Yonggang LI
Life of this patent
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Abstract
The present disclosure generally relates to a method. The method may include providing a substrate and forming a seed layer on the substrate. The method may further include forming a first metal layer on selected portions of the seed layer to form exposed portions of the seed layer. The method may also include scanning a laser beam across the substrate to remove the exposed portions of the seed layer to form exposed portions of the substrate.
Claims20
A method comprising:
- providing a substrate;
- forming a seed layer on the substrate;
- forming a first metal layer on selected portions of the seed layer to form exposed portions of the seed layer;
- and
- scanning a laser beam across the substrate to remove the exposed portions of the seed layer to form exposed portions of the substrate.
2 more elements
An assembly comprising:
- a substrate;
- a seed layer on the substrate;
- a first metal layer on selected portions of the seed layer to define exposed portions of the seed layer;
- wherein the assembly comprises exposed portions of the substrate.
1 more element
Dependencies are inferred from the claim text.