Laser diode package
AssigneeEOL, Inc.
InventorsSu Hyun Kim, Dai Hyoung Koo, Gi Hwan Myeong
Life of this patent
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AssigneeEOL, Inc.
InventorsSu Hyun Kim, Dai Hyoung Koo, Gi Hwan Myeong
Estimating the term…
A laser diode package according to the present disclosure includes a packaging housing unit and a coolant housing unit, wherein the coolant housing unit is coupled to the packaging housing unit, includes a coolant inlet through which coolant is introduced and a coolant outlet through which the coolant is discharged, and has a coolant flow path therein, and laser light source units disposed on a base of the packaging housing unit and each including a laser diode configured to emit a laser beam, wherein the laser light source unit includes a cooler coupled to the base, including a coolant channel connected to the coolant flow path of the coolant housing unit, and having at least an upper surface made of a metal layer, and a submount bonding-coupled to the upper surface of the cooler and having an upper surface to which the laser diode is bonding-coupled.
A laser diode package comprising:
Dependencies are inferred from the claim text.