Semiconductor laser device, submount, submount assembly, and method of testing semiconductor laser device
AssigneeNuvoton Technology Corporation Japan
InventorsYasuo BABA, Tohru NISHIKAWA
Life of this patent
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Abstract
A semiconductor laser device includes: a pedestal; a submount that is joined to the pedestal via solder; and a semiconductor laser that is mounted on the submount. When a view of the submount from a side on which the semiconductor laser is mounted is defined as a top view, in the top view: the solder includes a plurality of protruding portions; and the plurality of protruding portions are provided on the pedestal outside the submount, protrude in directions away from an inside of the submount, and are located at regular intervals on at least a portion of a periphery of the submount.
Claims20
A semiconductor laser device comprising:
- a pedestal;
- a submount that is joined to the pedestal via solder;
- and
- a semiconductor laser that is mounted on the submount,
- wherein when a view of the submount from a side on which the semiconductor laser is mounted is defined as a top view, in the top view:
- the solder includes a plurality of protruding portions;
- and
- the plurality of protruding portions are provided on the pedestal outside the submount, protrude in directions away from an inside of the submount, and are located at regular intervals on at least a portion of a periphery of the submount.
A submount comprising:
- an insulative component;
- a metal film;
- and
- a solder layer,
- wherein the metal film is disposed on a surface of the insulative component on one side,
- the solder layer is disposed on a surface of the metal film on the one side, and
- an outer edge of the surface of the metal film on the one side includes a portion in which a first region in which the solder layer is located and a second region in which the solder layer is not located are alternately located.
A submount assembly comprising:
- a substrate;
- a metal film;
- and
- a solder layer,
- wherein the metal film is disposed on a surface of the substrate on one side,
- the solder layer is disposed on a surface of the metal film on the one side,
- grooves in a lattice pattern are provided on a surface of the submount assembly on an other side or alteration portions in a lattice pattern are provided inside the substrate, the other side being opposite to the one side, and
- a portion in which regions not including the solder layer are located at regular intervals is located immediately below one of the grooves or one of the alteration portions.
A method of testing a semiconductor laser device,
- wherein the semiconductor laser device includes:
- a pedestal;
- a submount that is joined to the pedestal via solder;
- and
- a semiconductor laser that is mounted on the submount,
- when a view of the submount from a side on which the semiconductor laser is mounted is defined as a top view, in the top view:
- the solder includes a protruding region that protrudes from an outer edge of the submount,
- the protruding region includes a plurality of protruding portions that protrude outwardly, and
- the method comprises determining a tilt of the submount by measuring a state of the plurality of protruding portions.
Dependencies are inferred from the claim text.