Back to results
US 2024/0178404 A1Published application
Copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same
AssigneeSK Nexilis Co., Ltd.
InventorsShan Hua JIN, Min Seok YOON
Life of this patent
Estimating the term…
Abstract
According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and having an R value in a range of 2.0 to 3.5.
Claims10
A copper foil comprising a copper film including 99.9 wt % or more of copper,
- wherein the copper foil has an R value in a range of 2.0 to 3.5,
- wherein R is calculated by Equation 1 below,
- R=log(WA/WB)/log(tA/tB) [Equation 1]
- wherein WA in Equation 1 is calculated using Equation 2 below,
- WA=[XA0+(XA45)X2+XA90]/4 [Equation 2]
- WB in Equation 1 is calculated using Equation 3 below,
- WB=[XB0+(XB45)X2+XB90]/4 [Equation 3]
- tA in Equation 1 means a thickness of a specimen before a tensile test,
- tB in Equation 1 means a thickness of the specimen after the tensile test,
- XA0, XA45, and XA90 in Equation 2 mean widths of central portions of specimens, which are collected in directions of 0°, 45°, and 90°, respectively, in a stretching direction before stretching, and
- XB0, XB45, and XB90 in Equation 3 mean widths of the central portions of the specimens, which are collected in directions of 0°, 45°, and 90°, respectively, in the stretching direction after the stretching.
8 more elements
A method for manufacturing a copper foil, the method comprising:
- preparing an electrolyte containing copper ions;
- forming a copper film;
- and
- forming a protective layer on the copper film,
- wherein the forming of the copper film includes forming the copper film on a rotating anode drum by electrically conducting a cathode plate and the rotating anode drum, which are disposed to be spaced apart from each other in the electrolyte in an electrolytic bath,
- wherein the electrolyte includes:
- copper ions at a concentration of 70 g/L to 100 g/L;
- sulfuric acid at a concentration of 70 g/L to 150 g/L;
- chlorine (Cl) at a concentration of 15 ppm to 25 ppm;
- lead ions (Pb2+) at a concentration of 1 ppm to 100 ppm;
- tungsten (W) at a concentration of 0.3 ppm to 5 ppm;
- hydrogen peroxide at a concentration of 1 ml/L to 10 ml/L;
- and
- an organic additive,
- wherein the organic additive includes at least one of a polishing agent (component A), a moderator (component B), a leveling agent (component C),
- wherein the polishing agent (component A) includes sulfonic acid or a metal salt thereof,
- the moderator (component B) includes a non-ionic water-soluble polymer, and
- the leveling agent (component C) includes at least one of nitrogen (N) and sulfur (S).
15 more elements
Dependencies are inferred from the claim text.