Display device and manufacturing method thereof
AssigneeAUO Corporation
InventorShih-Hsiung Lin
Life of this patent
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Abstract
A display device including a circuit substrate, a first light-emitting diode, an anisotropic conductive adhesive structure, and a conductive connection element is provided. The first light-emitting diode is located above the circuit substrate. The anisotropic conductive adhesive structure is located between the circuit substrate and the first light-emitting diode, and electrically connects the circuit substrate to a lower electrode of the first light-emitting diode. The conductive connection element electrically connects the upper electrode of the first light-emitting diode to the circuit substrate. A portion of the conductive connection element is located on the anisotropic conductive adhesive structure.
Claims17
A display device, comprising:
- a circuit substrate;
- a first light-emitting diode, located above the circuit substrate;
- an anisotropic conductive adhesive structure, located between the circuit substrate and the first light-emitting diode, and electrically connecting the circuit substrate to a lower electrode of the first light-emitting diode, wherein, taking a top surface of the circuit substrate as reference, a height of a top surface of the anisotropic conductive adhesive structure is greater than or equal to a height of a top surface of a light-emitting layer of the first light-emitting diode, and the height of the top surface of the anisotropic conductive adhesive structure is lower than a height of an upper electrode of the first light-emitting diode;
- and
- a conductive connection element, electrically connecting the upper electrode of the first light-emitting diode to the circuit substrate, wherein a portion of the conductive connection element is located on the anisotropic conductive adhesive structure.
A manufacturing method of a display device, comprising:
- placing an anisotropic conductive adhesive structure above a circuit substrate;
- disposing a first light-emitting diode above the circuit substrate, wherein the anisotropic conductive adhesive structure is located between the circuit substrate and the first light-emitting diode;
- pressurizing the first light-emitting diode so that the first light-emitting diode is trapped into the anisotropic conductive adhesive structure, wherein, taking a top surface of the circuit substrate as reference, a height of a top surface of the anisotropic conductive adhesive structure is greater than or equal to a height of a top surface of a light-emitting layer of the first light-emitting diode, and the height of the top surface of the anisotropic conductive adhesive structure is lower than a height of an upper electrode of the first light-emitting diode, wherein the anisotropic conductive adhesive structure electrically connects the circuit substrate to a lower electrode of the first light-emitting diode;
- and
- forming a conductive connection element on the upper electrode of the first light-emitting diode, the anisotropic conductive adhesive structure, and the circuit substrate, wherein the conductive connection element electrically connects the upper electrode of the first light-emitting diode to the circuit substrate.
Dependencies are inferred from the claim text.