Photonic integrated circuit packages including substrates with glass cores

A photonic assembly, comprising:

• an interposer having a first surface, an opposing second surface, and a lateral surface substantially perpendicular to the first and second surfaces, wherein a material of the interposer includes glass, and the interposer includes through-glass vias (TGVs);
• a photonic integrated circuit (PIC) and an integrated circuit (IC) electrically coupled, at the second surface of the interposer, to the TGVs by interconnects having a pitch of between 2 microns and 70 microns between adjacent interconnects, and the PIC optically coupled to the second surface of the interposer by optical glue or fusion bonding;
• and
• an optical component coupled to the lateral surface of the interposer, wherein the optical component is optically coupled to the PIC by an optical pathway through the interposer.

A photonic assembly, comprising:

• an interposer having a first surface and an opposing second surface, wherein a material of the interposer includes glass, and the interposer includes through-glass vias (TGVs);
• a plurality of photonic integrated circuits (PICs) optically coupled to the surface of the interposer by optical glue or by fusion bonding and electrically coupled to the TGVs in the interposer by interconnects;
• and
• a plurality of fiber connectors coupled to the interposer, the plurality of fiber connectors optically coupled to the plurality of PICs by optical pathways through the interposer.