Electronic device package emi shielding with grounded mold interconnect

A method of fabricating an electronic device, the method comprising:

• attaching a semiconductor die to a first substrate side of a multilevel package substrate with a die terminal of the semiconductor die electrically coupled to a first conductive pad of the multilevel package substrate;
• forming a molded package structure over the semiconductor die and a portion of the first substrate side;
• forming a hole through the molded package structure to expose a second conductive pad of the multilevel package substrate or a conductive material above the second conductive pad of the multilevel package substrate;
• filling the hole with conductive material to form a conductive package via that extends through the molded package structure and contacts the second conductive pad or the conductive material above the second conductive pad;
• and
• forming a metal shield along a package side of the molded package structure, the metal shield contacting the conductive package via.