Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark

A method of forming a mark, comprising:

• providing a semiconductor device, wherein the semiconductor device comprises an interposer, a first redistribution structure, a second redistribution structure and a through hole structure, the first redistribution structure is located on a first side of the interposer, the second redistribution structure is located on a second side of the interposer, the first side is opposite to the second side, and the through hole structure passes through the interposer and connects with the first redistribution structure and the second redistribution structure;
• forming a marking material on the first redistribution structure, the marking material comprising a resin, a curing agent, fillers and a solvent;
• and
• sintering the marking material to make the resin cross-link and cure to form a cured product protruding from the first redistribution structure.