Overlying fiducial design for glass placement accuracy improvement

An interposer, comprising:

• a substrate, wherein the substrate comprises glass;
• a first fiducial mark embedded in a first recess into a first surface of the substrate, wherein the first fiducial mark is proximate a first corner of the substrate;
• and
• a second fiducial mark embedded in a second recess into the first surface of the substrate, wherein the second fiducial mark is proximate a second corner of the substrate, wherein the first corner is opposite from the second corner.

An electronic system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises a first fiducial mark;
• an interposer coupled to the package substrate, wherein the interposer comprises glass and a second fiducial mark, and wherein the second fiducial mark at least partially overlaps the first fiducial mark;
• and
• a die coupled to the interposer.