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US 2024/0178147 A1Published application
Power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsHan Jin DO, Jin Myeong YANG, Sung Won PARK
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Abstract
A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.
Claims20
A power module comprising:
- an upper substrate including a first insulating layer and a first metal layer disposed on a lower surface of the first insulating layer;
- a lower substrate disposed below the upper substrate, and including a second insulating layer and a second metal layer disposed on an upper surface of the second insulating layer to face the first metal layer;
- a first semiconductor chip disposed on the second metal layer;
- a first spacer extending in a vertical direction of the power module and electrically connecting the first metal layer to the second metal layer;
- a second spacer extending in the vertical direction and electrically connecting the first semiconductor chip to the first metal layer;
- a first connection layer having conductivity and disposed between the upper substrate and the lower substrate to traverse a middle portion of each of the first spacer and the second spacer;
- and
- a power lead disposed on the second metal layer.
5 more elements
Dependencies are inferred from the claim text.