Embedded Die Package
AssigneeCompass Technology Company Limited
InventorsKelvin Po Leung Pun, Chee Wah Cheung, Jason Rotanson
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Abstract
A flexible substrate embedded die package is described comprising a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate, a semiconductor die attached by an adhesive to the flexible substrate and a dielectric bonding film surrounding the semiconductor die and sealing the semiconductor die to the flexible substrate.
Claims27
A flexible substrate embedded die package comprising:
- a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate;
- a semiconductor die attached by an adhesive to said flexible substrate;
- and
- a dielectric bonding film surrounding said semiconductor die and sealing said semiconductor die to said flexible substrate.
A method for fabricating a flexible substrate embedded die package comprising:
- providing a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate;
- die attaching a semiconductor die by an adhesive to said flexible substrate;
- laminating a dielectric bonding film onto said flexible substrate and said semiconductor die;
- and
- curing said dielectric bonding film to seal said semiconductor die to said flexible substrate.
A flexible substrate embedded die package comprising:
- a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate;
- a first semiconductor die attached by an adhesive to said top metal layer of said flexible substrate;
- a second semiconductor die attached by an adhesive to said bottom metal layer of said flexible substrate;
- and
- a dielectric bonding film surrounding said first and second semiconductor dies and sealing said first and second semiconductor dies to said flexible substrate.
A flexible substrate embedded die package comprising:
- a first multi-layer flexible substrate comprising a first dielectric substrate, a first top metal layer and a first bottom metal layer connected with first micro-via interconnection through said first dielectric substrate;
- a semiconductor die attached by an adhesive to said first flexible substrate;
- a first dielectric bonding film surrounding said semiconductor die and sealing said semiconductor die to said first flexible substrate;
- circuitry on top of said dielectric bonding film to fan out internal circuitry of said semiconductor die onto said first flexible substrate;
- and
- a second multi-layer flexible substrate comprising a second dielectric substrate, a second top metal layer and a second bottom metal layer connected with second micro-via interconnection through said second dielectric substrate and attached by a second dielectric bonding film to said first multi-layer flexible substrate with second micro-via interconnection through said second dielectric substrate.
Dependencies are inferred from the claim text.