Leadframe based power module
OwnerMakoto Shibuya, Daiki Komatsu +1inventors
InventorsMAKOTO SHIBUYA, DAIKI KOMATSU, MASAMITSU MATSUURA
Life of this patent
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Abstract
An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.
Claims20
An electronic device comprising:
- a leadframe having pins, the pins having a proximate end and a distal end;
- a die attached to the proximate end of the pins of the leadframe;
- a mold compound encapsulating the die;
- and
- an electronic component attached to the leadframe,
- wherein the distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.
A method comprising:
- providing a leadframe having pins comprised of a proximate end and a distal end;
- attaching a die to the proximate end of the pins;
- forming a mold compound over the die;
- forming the distal end of at least two pins substantially perpendicular to the proximate end of the pins in a first direction;
- forming the distal end of remaining pins substantially perpendicular to the proximate end of the pins in a second direction, the second direction being opposite to the first direction;
- and
- attaching an electronic component to a mounting surface portion of the at least two pins on a side of the leadframe that is opposite to that of the die.
A method of fabricating electronic devices comprising:
- providing an array of leadframes, each leadframe of the array of leadframes having inner pins comprised of a proximate end and a distal end and outer pins comprised of a proximate end, a distal end, and a tie bar connection end, the leadframes being connected to each other via a first tie bar connected to the distal end of the inner and outer pins and a second tie bar connected to the tie bar connection end of the outer pins to form the array;
- attaching dies to the proximate end of the inner and outer pins;
- forming a mold compound over the dies;
- removing the first tie bar from the distal end of the inner and outer pins via a first punch die process;
- forming the distal end of the outer pins substantially perpendicular to the proximate end of the inner and outer pins in a first direction;
- forming the distal end of the inner pins substantially perpendicular to the proximate end of the inner and outer pins in a second direction, the second direction being opposite to the first direction;
- attaching electronic components to an exposed surface of mounting surface portions of the outer pins on a side of the leadframes that is opposite that of the dies;
- removing the second tie bar from the tie bar connection end of the outer pins via a second punch die process;
- and
- trimming the tie bar connection end of the outer pins.
Dependencies are inferred from the claim text.