System in package with flip chip die over multi-layer heatsink stanchion

An apparatus comprising:

• a chiplet having a first die and a substrate that includes a plurality of dielectric layers, at least one heatsink stanchion, and at least one via structure, wherein:
• the at least one heatsink stanchion includes a plurality of heatsink metal plates and a plurality of heatsink metal bars, which is vertically alternated with the plurality of heatsink metal plates;
• the at least one via structure includes a plurality of via metal plates and a plurality of via metal bars, which is vertically alternated with the plurality of via metal plates;
• the plurality of heatsink metal bars is configured in a layered-cake shape;
• at least one of the plurality of heatsink metal bars in the at least one heatsink stanchion is more than ten times larger than one of the plurality of via metal bars in the at least one via structure in a horizontal plane;
• and
• the first die is deposed over the substrate and connected to the at least one heatsink stanchion and the at least one via structure, such that heat generated by the first die is eligible to be dissipated by the at least one heatsink stanchion within the substrate, and signals are eligible to be transmitted to and received from the first die through the at least one via structure.