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US 2024/0178094 A1Published application
Semiconductor package
AssigneeJMJ Korea Co., Ltd.
InventorYun Hwa CHOI
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor package in which a heat radiation substrate and a housing are separately formed and are bonded to each other through an insulating layer or an adhesive member so that a manufacturing process thereof is suitable for mass-production and thereby, productivity may be increased.
Claims20
A semiconductor package comprising:
- a heat radiation substrate;
- one or more insulating layers disposed on the heat radiation substrate;
- one or more metal pattern layers disposed on the insulating layers;
- a housing disposed on the insulating layer;
- one or more semiconductor chips installed on the metal patter layers;
- electrically connecting members for electrical connection between the metal pattern layers and the semiconductors chip or between each of a plurality of semiconductor chips, if the semiconductor chip is in a plural number;
- one or more terminals formed uprightly on the metal pattern layers;
- and
- a molding sealing member molded to cover the semiconductor chips, the electrically connecting members, and at least a part of the terminals,
- wherein a thickness of the housing is greater than a thickness of the metal pattern layer and at least one terminal is formed to be higher than the upper end surface of the housing so that the upper ends of the at least one terminal are exposed to the upper part of the molding sealing member and thereby, are electrically bonded to external electrical connecting members.
7 more elements
A semiconductor package comprising:
- a heat radiation substrate;
- an adhesive member disposed on the heat radiation substrate;
- an insulating substrate which is disposed on the adhesive member and comprises one or more insulating layers;
- a housing disposed on the adhesive member;
- one or more semiconductor chips installed on the insulating substrate;
- electrically connecting members for electrical connection between the insulating substrate and the semiconductors chips or between each of a plurality of semiconductor chips, if the semiconductor chip is in a plural number;
- one or more terminals formed uprightly on the insulating substrate;
- and
- a molding sealing member molded to cover the semiconductor chips, the electrically connecting members, and at least a part of the terminals,
- wherein a thickness of the housing is greater than a thickness of the insulating substrate and at least one terminal is formed to be higher than the upper end surface of the housing so that the upper ends of the at least one terminal are exposed to the upper part of the molding sealing member and thereby, are electrically bonded to external electrical connecting members.
7 more elements
Dependencies are inferred from the claim text.