Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus

A method for manufacturing a semiconductor device, comprising:

• applying an adhesive in such a manner as to surround a region on a substrate where a cooling medium is disposed;
• injecting the cooling medium into a region surrounded by the adhesive;
• and
• adhering a semiconductor element onto the adhesive.

A method for manufacturing a semiconductor device, comprising:

• applying an adhesive in such a manner as to surround a region on a substrate where a cooling medium is disposed;
• adhering a semiconductor element onto the adhesive;
• injecting the cooling medium into a clearance formed by the substrate, the adhesive, and the semiconductor element;
• and
• sealing the clearance.

A method for manufacturing a semiconductor device, comprising:

• placing metal-coated small spheres on a plurality of recesses provided on a substrate;
• applying an adhesive in such a manner as to surround the disposed metal-coated small spheres;
• and
• adhering a semiconductor element onto the adhesive.

A method for manufacturing a semiconductor device, comprising:

• placing metal-coated small spheres on a plurality of soldering pads disposed on a substrate;
• soldering the placed metal-coated small spheres;
• applying an adhesive in such a manner as to surround the placed metal-coated small spheres;
• and
• adhering a semiconductor element onto the adhesive.

A method for manufacturing a semiconductor device, comprising:

• placing metal-coated small spheres on a plurality of soldering pads disposed on a lower surface of a semiconductor element;
• soldering the placed metal-coated small spheres;
• applying an adhesive to the substrate or the lower surface of the semiconductor element in such a manner as to surround the metal-coated small spheres when the surface of the semiconductor element to which the metal-coated small spheres are soldered is placed on the substrate;
• and
• adhering the surface of the semiconductor element to which the metal-coated small spheres are soldered onto the adhesive.

An electronic apparatus having a semiconductor device, comprising:

• a semiconductor element;
• a substrate to which the semiconductor element is fixed;
• and
• a cooling medium with which a clearance formed when the semiconductor element and the substrate are fixed to each other is filled.