Package structure

A package structure, comprising:

• a semiconductor die laterally encapsulated by an insulating encapsulation;
• a redistribution layer structure disposed on the semiconductor die and the insulating encapsulation, the redistribution layer structure comprising a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers;
• and
• an electronic device disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the outermost redistribution conductive layer comprises a recess covered by the backside dielectric layer.

A package structure, comprising:

• a semiconductor die laterally encapsulated by an insulating encapsulation;
• a redistribution layer structure disposed on the semiconductor die and the insulating encapsulation, the redistribution layer structure comprising a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers;
• and
• an electronic device disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and an adhesion enhancement interface is between the outermost redistribution conductive layer and the backside dielectric layer.